WELCOME MESSAGE

On behalf of the Organizing Committee, it is our great honor to welcome you to the 2026 IEEE International Conference on High Voltage Engineering and Application (ICHVE 2026), to be held from September 20-25, 2026, in São Paulo, Brazil. Hosted by the Institute of Energy and Environment of the University of São Paulo (IEE/USP) and the Federal University of Campina Grande (UFCG), and sponsored by the IEEE Dielectrics and Electrical Insulation Society (DEIS), this event promises to be a milestone in the field.
 

Building on the legacy of past editions - Chongqing (2008), New Orleans (2010), Shanghai (2012), Poznań (2014), Chengdu (2016), Athens (2018), Beijing (2020), Chongqing (2022) and Berlin (2024) -, ICHVE has cemented its reputation as a premier global platform for advancing knowledge, innovation, and collaboration in High Voltage and Power Engineering.
 

ICHVE 2026 will feature a world-class scientific program, including plenary sessions, invited lectures, and technical presentations led by renowned experts from academia and industry. The conference will explore the latest breakthroughs in High Voltage Engineering, fostering interdisciplinary dialogue and partnerships.
 

We warmly invite you to submit your cutting-edge research and join us for what will be both a stimulating academic event and an unforgettable experience in São Paulo, a city brimming with culture and energy.
 

With great anticipation, we look forward to welcoming you to São Paulo in 2026!
 

Prof. Alexandre Piantini, Chair of ICHVE 2026
Prof. Edson Guedes da Costa, Co-Chair of ICHVE 2026

 

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NEWS
 

The online registration and abstract submission are available in
https://www.conftool.org/ichve2026

The abstract submission was extended to Feb. 20, 2026 (UTC)